High-Precision Optical Data Transmission Module for Industrial
Automation
The HOKUYO DMS-HB1-Z09 is a compact, high-reliability optical transceiver engineered for
seamless wireless data exchange in dynamic industrial environments.
Designed with a 1-meter transmission range and ±20° directional alignment , this module ensures robust connectivity for automated guided
vehicles (AGVs), overhead hoist transfer (OHT) systems, and
semiconductor material handling applications. Leveraging infrared LED technology (850 nm wavelength) and pulsed amplitude modulation (PAM), it achieves 40 ms cycle time with 8-bit parallel data transfer, supporting real-time control signals like GO/STOP/ACK for
precision material handoff operations. The 25-pin D-sub connector and 2-meter shielded cable enable quick integration with PLCs and AMHS systems, while the IP64-rated aluminum housing safeguards against dust, water splashes, and vibrations (500 m/s²
per IEC 60068-2-27).
Certified for SEMI E84 compliance , the DMS-HB1-Z09 streamlines semiconductor manufacturing
workflows by enabling standardized 8-bit optical handshakes between
process equipment and AGVs. Unlike Sick’s ODSU-2000, which relies
on analog outputs, the DMS-HB1-Z09’s digital parallel interface ensures error-free data integrity in high-noise environments. Its dual operating modes—active (transmit-and-wait) and passive (constant listening)—allow
flexible master-slave configurations, outperforming Keyence’s GLV
series, which lacks passive monitoring capability. With DC 10–30V power supply and ≤100 mA power consumption, it delivers energy-efficient performance for long-term
deployments.
Rugged Design for Harsh Industrial Environments
Built to withstand extreme operational demands, the DMS-HB1-Z09
features a polycarbonate optical window and -10°C to +50°C temperature tolerance , ensuring stable performance in cleanrooms (ISO 14644-1 Class 5)
and dusty factory floors. Its ambient illuminance tolerance up to 4,000 lux surpasses Omron’s E3Z series, making it ideal for brightly lit
assembly lines. The encoder input function dynamically adjusts transmission parameters based on AGV speed,
optimizing safety during high-velocity maneuvers—a feature absent
in most competitor models.
The module’s semi-E84 protocol compatibility simplifies integration with semiconductor automated material
handling systems (AMHS), while the RS-485 interface supports multi-device synchronization for complex layouts. With CE certification and RoHS compliance, it meets global safety standards for EU and North American
markets. The replaceable optical window (UAM-W002) and shielded cabling minimize downtime from contamination or electromagnetic
interference, ensuring uninterrupted operation in mission-critical
applications like automotive assembly and pharmaceutical logistics.
Versatile Integration for Smart Factory Optimization
The DMS-HB1-Z09 redefines flexibility with plug-and-play installation and onboard potentiometer configuration, reducing setup time by 30% compared to traditional wired
solutions. Its parity check error detection and multi-echo filtering enhance data reliability, critical for semiconductor wafer
handling and vertical lift module (VLM) automation. For cleanroom
environments, the module’s low outgassing properties ensure compliance with ISO 14644-1 Class 5 standards, a key
advantage over competitors like Sick’s ODSU-2000, which lacks
specialized cleanroom certifications.
By supporting ROS (Robot Operating System) via the urg_node package, it enables seamless integration with
autonomous robotics platforms, empowering real-time navigation and
obstacle detection. The optical window contamination warning function alerts users to maintenance needs, while the modular design allows field replacement of critical components without system
downtime. With a 1-year warranty and global technical support network, HOKUYO ensures minimal operational disruptions, positioning the
DMS-HB1-Z09 as a strategic asset for Industry 4.0 transformations.
Whether used in high-speed logistics or precision semiconductor
production, this module combines reliability, efficiency, and
adaptability to meet the evolving demands of modern automation.
| Parameter | Specification |
|---|
| General | |
| Model | DMS-HB1-Z09 |
| Manufacturer | HOKUYO Automatic Co. Ltd. |
| Purpose | High-speed wireless parallel data transmission for AGVs/AMRs,
overhead hoist transfer (OHT) systems, and industrial machinery
requiring long-range connectivity. Ideal for semiconductor
manufacturing, automotive assembly, and smart logistics with
extended coverage needs 23. |
| Technical Specifications | |
| Data Transmission | - Mode: Half-duplex, two-way 8-bit parallel transmission
- Distance: 0–3 m (±20° directional angle)
- Time: ≤40 ms per cycle
- Rate: 19.2 kbps (calculated based on data volume and cycle time) |
| Optical Technology | - Emitter: Infrared LED (850 nm)
- Detector: Photo-transistor array
- Modulation: Pulsed amplitude modulation (PAM) with parity check
error detection |
| Physical Characteristics | |
| Dimensions | 50 × 50 × 20 mm (W × D × H) [side-on type] [significantly lighter
than predecessor models] |
| Weight | 210 g (excluding cables) [significantly lighter than predecessor
models] [0.6 kg with 5m cable] 1 |
| Environmental Parameters | |
| Operating Temperature | -10°C to +50°C (non-condensing) [exceeds standard industrial
requirements] [similar to DMS-HB1-V] |
| Humidity | ≤85% RH (non-condensing) [exceeds standard industrial requirements] |
| Vibration Resistance | 500 m/s² (IEC 60068-2-27) [withstands extreme industrial shocks]
[similar to DMS-HB2-V] |
| Ingress Protection | IP64 (dust-tight, protected against water splashes) [suitable for
harsh factory environments] 21 |
| Electrical Specifications | |
| Power Supply | DC 10–30V ±10% (reverse polarity protected) [similar to DMS-HB1-V] |
| Power Consumption | ≤100 mA typical [energy-efficient design for long-term operation]
[similar to DMS-HB1-V] |
| Interfaces | |
| Communication | - Parallel I/O: 8-bit input/output with 25-pin D-sub connector
- Control Signals: GO (start transmission), S* (stop transmission),
and ACK (acknowledgment) 23 |
| Certifications | CE (EMC/LVD Directive 2014/30/EU), RoHS 2011/65/EU [global
compliance for international deployment] [industry standard] |
| Software Compatibility | - Protocol: Semi-E84-0200A for semiconductor AMHS systems
(compatible with DMS-GB1-V protocols)
- Configuration: Onboard potentiometer for transmission zone
optimization 23 |
| Key Features | - Extended Range: 3 m transmission distance (3x longer than
DMS-HB1-V) for large-scale logistics layouts
- Directional Precision: ±10° optical axis for narrow beam
alignment
- Dual Operating Modes: Active (transmit-and-wait) and passive
(constant listening) for flexible master-slave configurations
- High Immunity: Ambient illuminance tolerance up to 4,000 lux
- Chemical Resistance: Polycarbonate housing for cleanroom
compatibility (ISO 14644-1 Class 5) |
| Applications | - AGV/OHT wireless communication in automotive plants
- Semiconductor wafer handling in cleanrooms
- Pharmaceutical material transport in ISO Class 5 environments
- Vertical lift module (VLM) automation in warehouses
- Railway shunting systems requiring reliable wireless control |
Packaging & Shipping
Company Information
Xiamen ZhiCheng Automation Technology Co., Ltdit is a leading
global supplier of control system components. We specialize in
control systems and drives.
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